Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18215107
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Filing Dt:
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06/27/2023
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Publication #:
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Pub Dt:
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10/26/2023
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Inventors:
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Ho-Chuan Lin, Min-Han Chuang, Chia-Chu Lai
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Title:
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--ELECTRONIC PACKAGE COMPRISING MULTIPLE WIRES INSIDE AN
ELECTRONIC COMPONENT--
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 123, SEC. 3, DAFENG RD., TANZI DIST. |
TAICHUNG CITY, TAIWAN 427 |
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SCOTT W. KELLEY |
6320 CANOGA AVENUE |
SUITE 1650 |
WOODLAND HILLS, CA 91367 |
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06/25/2024 11:27 AM
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