Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18014009
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Filing Dt:
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12/30/2022
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Publication #:
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Pub Dt:
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10/26/2023
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Inventors:
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Guoliang YE, Hongsheng YI
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Title:
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WAFER BONDING STRUCTURE, WAFER BONDING METHOD AND CHIP BONDING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 18 GAOXIN 4TH ROAD, DONGHU DEVELOPMENT ZONE |
| WUHAN, HUBEI, CHINA 430205 |
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| MUNCY, GEISSLER, OLDS & LOWE, PC |
| 125 S. ROYAL ST. |
| ALEXANDRIA, VA 22314 |
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