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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17882203
Filing Dt:
08/05/2022
Publication #:
Pub Dt:
10/26/2023
Inventors:
Jaejik BAEK, Byounghak Hong, Inchan Hwang, Kang-ill Seo
Title:
3D-STACKED SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN INNER SPACERS FORMED USING CHANNEL ISOLATION STRUCTURE INCLUDING THIN SILICON LAYER
Assignment: 1
Reel/Frame:
060736/0131Recorded: 08/05/2022Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/21/2022
Exec Dt:
07/22/2022
Exec Dt:
07/22/2022
Exec Dt:
07/21/2022
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO
SUWON-SI, KOREA, REPUBLIC OF 16677
Correspondent:
SUGHRUE MION, PLLC
2000 PENNSYLVANIA AVENUE, N.W.
SUITE 9000
WASHINGTON, DC 20006

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