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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17726812
Filing Dt:
04/22/2022
Publication #:
20230343857
Pub Dt:
10/26/2023
Inventors:
An-Hung TAI, Chia-Wei CHEN, Shih-Hang CHIU, Yu-Hong LU, Hui-Chi CHEN, Kuo-Feng YU et al
Title:
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
059677/0667Recorded: 04/22/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TAI, AN-HUNG
Exec Dt:
03/28/2022
CHEN, CHIA-WEI
Exec Dt:
03/29/2022
CHIU, SHIH-HANG
Exec Dt:
03/28/2022
LU, YU-HONG
Exec Dt:
04/11/2022
CHEN, HUI-CHI
Exec Dt:
03/28/2022
YU, KUO-FENG
Exec Dt:
03/28/2022
CHEN, JIAN-HAO
Exec Dt:
03/29/2022
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
MCDERMOTT WILL & EMERY LLP
THE MCDERMOTT BUILDING
500 NORTH CAPITOL STREET, NW
WASHINGTON, DC 20001

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