Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18219972
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Filing Dt:
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07/10/2023
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Publication #:
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Pub Dt:
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11/02/2023
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Inventors:
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Kentaro MIYOSHI, Hiroshi IGARASHI
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Title:
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BONDING MATERIAL, METHOD FOR PRODUCING BONDING MATERIAL, AND BONDED BODY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3-26, KOYAMA 1-CHOME, SHINAGAWA-KU |
TOKYO, JAPAN 142-8558 |
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PAUL T. BOWEN/NIXON & VANDERHYE P.C. |
901 N. GLEBE ROAD |
11TH FLOOR |
ARLINGTON, VA 22203 |
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09/23/2024 02:48 PM
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