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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17731852
Filing Dt:
04/28/2022
Publication #:
20230352394
Pub Dt:
11/02/2023
Inventors:
Chen-Te CHU, Yuan-Yang HSIAO, Chih-Pin CHIU, Ying-Yao LAI, Mao-Nan WANG, Chen-Chiu HUANG et al
Title:
SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
060278/0059Recorded: 06/22/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHU, CHEN-TE
Exec Dt:
05/25/2022
HSIAO, YUAN-YANG
Exec Dt:
05/25/2022
CHIU, CHIH-PIN
Exec Dt:
06/05/2022
LAI, YING-YAO
Exec Dt:
06/05/2022
WANG, MAO-NAN
Exec Dt:
05/26/2022
HUANG, CHEN-CHIU
Exec Dt:
05/25/2022
CHEN, DIAN-HAU
Exec Dt:
05/25/2022
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP.
8110 GATEHOUSE ROAD, SUITE 100E
FALLS CHURCH, VA 22040-0747

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