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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	NONE	Issue Dt:		Application #:	18218882	Filing Dt:	07/06/2023
Publication #:	20230352573	Pub Dt:	11/02/2023
Inventors:	Hisao SATO, Koji OKUNO, Daisuke SHINODA, Toshiya UEMURA, Hironobu NARUI, Hiroji KAWAI et al
Title:	SEMICONDUCTOR ELEMENT AND DEVICE

Assignment: 1

Reel/Frame:

064183/0073

Recorded: 07/07/2023

Pages: 8

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

SATO, HISAO

Exec Dt:

06/26/2023

OKUNO, KOJI

Exec Dt:

06/26/2023

SHINODA, DAISUKE

Exec Dt:

06/26/2023

UEMURA, TOSHIYA

Exec Dt:

06/26/2023

NARUI, HIRONOBU

Exec Dt:

06/23/2023

KAWAI, HIROJI

Exec Dt:

06/23/2023

YAGI, SHUICHI

Exec Dt:

06/23/2023

Assignees:

TOYODA GOSEI CO., LTD.

1 HARUHINAGAHATA

KIYOSU-SHI, AICHI-KEN, JAPAN 452-8564

POWDEC K.K.

1-23-15 WAKAGI-CHO

OYAMA-SHI, TOCHIGI, JAPAN 323-0028

Correspondent:

MCGINN INTELLECTUAL PROPERTY LAW GROUP, PLLC

8321 OLD COURTHOUSE ROAD

SUITE 200

VIENNA, VA 22182-3817

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