Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18351188
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Filing Dt:
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07/12/2023
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Publication #:
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Pub Dt:
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11/02/2023
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Inventors:
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Chieh Hu, Chun-Chin Tu, Lunghsing Hsu
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Title:
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METHODS FOR SEMICONDUCTOR WAFER PROCESSING USING A RADIANT HEAT CAP IN A SEMICONDUCTOR WAFER REACTOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8. INDUSTRIAL ROAD 2 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| PATENT DOCKETING DEPT - ARMSTRONG TEASDALE LLP |
| 7700 FORSYTH BOULEVARD |
| SUITE 1800 |
| ST. LOUIS, MO 63105 |
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