Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17744737
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Filing Dt:
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05/16/2022
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Publication #:
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Pub Dt:
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11/16/2023
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Inventors:
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Su-Chun Yang, Jih-Churng Twu, Jiung Wu, Chih-Hang Tung, Chen-Hua Yu
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Title:
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DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND FORMATION METHOD OF THE DIE STACKING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300-78 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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