Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17750148
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Filing Dt:
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05/20/2022
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Publication #:
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Pub Dt:
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11/23/2023
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Inventors:
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Yu-Ling CHANG CHIEN, Yahru CHENG, Chin-Hsiang LIN, Yu-Chung SU, Ching-Yu CHANG
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Title:
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SYSTEM AND METHOD FOR DIRECTED SELF-ASSEMBLY WITH HIGH BOILING POINT SOLVENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| SEED IP LAW GROUP LLP |
| 701 5TH AVE |
| SUITE 5400 |
| SEATTLE, WA 98104 |
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