Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18227858
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Filing Dt:
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07/28/2023
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Publication #:
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Pub Dt:
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11/23/2023
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Inventors:
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Chih-Min HSIAO, Chih-Ming LAI, Ru-Gun LIU, Chien-Wen LAI, Ya HuI CHANG
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Title:
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LANDING METAL ETCH PROCESS FOR IMPROVED OVERLAY CONTROL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 300 |
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| STUDEBAKER & BRACKETT PC |
| 8255 GREENSBORO DRIVE |
| SUITE 300 |
| TYSONS, VA 22102 |
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