Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18197607
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Filing Dt:
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05/15/2023
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Publication #:
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Pub Dt:
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11/23/2023
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Inventors:
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HO-CHIEH YU, CHEN-CHENG-LUNG LIAO, CHUN-YU LIN, JASON AN CHENG HUANG, CHIH-CHUAN LIANG et al
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Title:
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Flip-Chip Packaged Power Transistor Module Having Built-in Gate Driver
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.526, NANSHANG RD., GUISHAN DIST, |
| TAOYUAN, TAIWAN 333014 |
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| NO.32, GONG 5 RD., LONGTAN, |
| TAOYUAN, TAIWAN 325019 |
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| CHEYANG CHEN |
| 17700 CASTLETON ST, SUITE 373, |
| CITY OF INDUSTRY, CA 91748 |
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