Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18366201
|
Filing Dt:
|
08/07/2023
|
|
Publication #:
|
|
Pub Dt:
|
11/30/2023
| | | | |
|
Inventors:
|
Frank SENGER, Shanshan GU-STOPPEL, Erdem YARAR, Gunnar WILLE
|
|
Title:
|
MEMS Package and Method for Encapsulating an MEMS Structure
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| HANSASTRAßE 27C |
| MÜNCHEN, GERMANY 80686 |
|
|
|
|
| IRENE REE |
| 11350 RANDOM HILLS ROAD, STE 800 |
| FAIRFAX, VA 22030 |
|
|
Search Results as of:
05/29/2024 10:26 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
