Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18362037
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Filing Dt:
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07/31/2023
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Publication #:
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Pub Dt:
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11/30/2023
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Inventors:
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Yung-Yao LEE, Cheng-Kang HU, Jui-Chun PENG, Hsu-Shui LIU
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Title:
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SEMICONDUCTOR WAFER COOLING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| HARRITY & HARRITY LLP |
| 11350 RANDOM HILLS RD. |
| SUITE 600 |
| FAIRFAX, VA 22030 |
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