Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18248870
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Filing Dt:
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04/13/2023
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Publication #:
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Pub Dt:
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11/30/2023
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Inventors:
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Jing WEI, Gang WEI, Yueping HUA
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Title:
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IMPEDANCE-MATCHING METHOD, IMPEDANCE-MATCHING DEVICE, AND SEMICONDUCTOR PROCESS APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8 WENCHANG AVENUE, BEIJING ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA |
| BEIJING, CHINA 100176 |
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| ANOVA LAW GROUP PLLC |
| 21495 RIDGETOP CIRCLE, SUITE 300 |
| STERLING, VA 20166 |
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