Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18142412
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Filing Dt:
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05/02/2023
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Publication #:
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Pub Dt:
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11/30/2023
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Inventors:
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Chengchung Lin, Jin Yang
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Title:
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FAN-OUT WAFER-LEVEL PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9 DONGSHENG WEST ROAD |
| JIANGYIN CITY, JIANGSU PROVINCE, CHINA 214437 |
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| ALSTON & BIRD |
| 1120 SOUTH TRYON STREET, SUITE 300 |
| CHARLOTTE, NC 28203-6818 |
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