Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18232200
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Filing Dt:
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08/09/2023
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Publication #:
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Pub Dt:
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11/30/2023
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Inventors:
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Jian-Hong LIN, Hsin-Chun CHANG, Ming-Hong HSIEH, Ming-Yih WANG, Yinlung LU
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Title:
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Through-Circuit Vias In Interconnect Structures
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C |
| 1101 K STREET |
| 10TH FLOOR |
| WASHINGTON, DC 20005 |
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