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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18232085
Filing Dt:
08/09/2023
Publication #:
Pub Dt:
11/30/2023
Inventors:
Feng-Chien HSIEH, Kuo-Cheng Lee, Chen-Ming Wu, Yun-Wei Cheng
Title:
SEMICONDUCTOR ARRANGEMENT WITH ISOLATION STRUCTURE
Assignment: 1
Reel/Frame:
064539/0821Recorded: 08/09/2023Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/16/2021
Exec Dt:
03/16/2021
Exec Dt:
03/16/2021
Exec Dt:
03/16/2021
Assignee:
NO. 8, LI-HSIN ROAD 6, HSIN-CHU SCIENCE PARK
HSIN-CHU, TAIWAN 300-78
Correspondent:
COOPER LEGAL GROUP LLC
1388 RIDGE ROAD, UNIT 1
HINCKLEY, OH 44233

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