Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/20/2024
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Application #:
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18360085
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Filing Dt:
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07/27/2023
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Publication #:
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Pub Dt:
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11/30/2023
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Inventors:
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Po-Yu Huang, Chen-Ming Lee, I-Wen Wu, Fu-Kai Yang, Mei-Yun Wang
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Title:
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SEMICONDUCTOR DEVICES WITH BACKSIDE VIA AND METHODS THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6 |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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HAYNES AND BOONE, LLP. |
2801 N. HARWOOD ST. |
SUITE 2300 |
DALLAS, TX 75201 |
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09/22/2024 09:09 AM
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