Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18034044
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Filing Dt:
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04/26/2023
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Publication #:
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Pub Dt:
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12/07/2023
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Inventors:
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Sang Hoo PARK, Jeong Su CHOI, Won Seok LEE, Roo Da LEE, Yeo Ju KIM, Jong Ju LEE
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Title:
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THERMOPLASTIC RESIN COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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128, YEOUI-DAERO, YEONGDEUNGPO-GU |
SEOUL, KOREA, REPUBLIC OF 07336 |
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COLLIN W. PARK |
MORGAN, LEWIS & BOCKIUS LLP |
1111 PENNSYLVANIA AVENUE NW |
WASHINGTON, DC 20004 |
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09/23/2024 08:57 PM
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