Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18032247
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Filing Dt:
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04/17/2023
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Publication #:
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Pub Dt:
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12/07/2023
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Inventors:
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Naoya NONAKA, Daisuke HIEDA, Hiroaki ISHIZAKI, Toshiyuki ISAMI, Koudai MOROIWA
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Title:
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METHOD FOR PRODUCING SUPPORT SUBSTRATE FOR BONDED WAFER, AND SUPPORT SUBSTRATE FOR BONDED WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1-2-1 SHIBAURA, MINATO-KU |
TOKYO, JAPAN 105-8634 |
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GREENBLUM & BERNSTEIN, P.L.C. |
1950 ROLAND CLARKE PLACE |
RESTON, VA 20191 |
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09/24/2024 03:41 AM
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