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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18450373
Filing Dt:
08/15/2023
Publication #:
20230395562
Pub Dt:
12/07/2023
Inventors:
Min-Hsun HSIEH, Shih-An LIAO, Ying-Yang SU, Hsin-Mao LIU, Tzu-Hsiang WANG, Chi-Chih PU
Title:
METHOD AND STRUCTURE FOR DIE BONDING USING ENERGY BEAM
Assignment: 1
Reel/Frame:
064600/0486Recorded: 08/15/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HSIEH, MIN-HSUN
Exec Dt:
08/26/2019
LIAO, SHIH-AN
Exec Dt:
08/21/2019
SU, YING-YANG
Exec Dt:
08/21/2019
LIU, HSIN-MAO
Exec Dt:
08/21/2019
WANG, TZU-HSIANG
Exec Dt:
08/26/2019
PU, CHI-CHIH
Exec Dt:
08/21/2019
Assignee:
EPISTAR CORPORATION
21, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
HUAN-YI LIN
4521 WELLFLEET DR
HUNTINGTON BEACH, CA 92649

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