Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18165285
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Filing Dt:
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02/06/2023
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Publication #:
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Pub Dt:
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12/07/2023
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Inventors:
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CHIA-SHUAI CHANG, CHIEN-CHEN LEE, LI-CHUN HUNG
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Title:
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SENSOR PACKAGE STRUCTURE AND CHIP-SCALE SENSOR PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6 F., NO. 83, YANPING S. RD., ZHONGZHENG DIST., |
TAIPEI CITY, TAIWAN 10043 |
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LI & CAI INTELLECTUAL PROPERTY OFFICE |
9F, NO. 69, SEC. 2 DUNHUA S. RD |
DA'AN DISTRICT |
TAIPEI, 106 TAIWAN |
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09/25/2024 06:27 PM
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