Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18113709
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Filing Dt:
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02/24/2023
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Publication #:
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Pub Dt:
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12/07/2023
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Inventors:
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CHIEN-CHEN LEE, LI-CHUN HUNG, CHIA-SHUAI CHANG
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Title:
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SENSOR PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6 F., NO. 83, YANPING S. RD., ZHONGZHENG DIST., |
| TAIPEI CITY, TAIWAN 10043 |
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| LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE |
| 3057 NUTLEY STREET, SUITE 818 |
| FAIRFAX, VA 22031 |
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