Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18094477
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Filing Dt:
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01/09/2023
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Publication #:
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Pub Dt:
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12/14/2023
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Inventors:
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Di CHEN, Juncheng LU, Ahmad MIZAN, Ruoyu HOU, Abhinandan DIXIT
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Title:
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DUAL-SIDE COOLED EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SUITE 201, 770 PALLADIUM DRIVE |
KANATA, CANADA K2V 1C8 |
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MILTONS IP/P.I. |
15 FITZGERALD RD. SUITE 200 |
OTTAWA, K2H 9G1 CANADA |
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09/21/2024 07:56 PM
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