Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18333854
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Filing Dt:
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06/13/2023
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Publication #:
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Pub Dt:
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12/21/2023
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Inventors:
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Wai Wai Lee, Ting Wei Chang, Jia Yunn Ting, Wei Leong Tan
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Title:
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METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS SUCH SEMICONDUCTOR PACKAGE ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| JONKERBOSPLEIN 52 |
| NIJMEGEN, NETHERLANDS 6534AB |
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| RUGGIERO MCALLISTER & MCMAHON LLC |
| ONE LANDMARK SQUARE |
| 18TH FLOOR |
| STAMFORD, CT 06901 |
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