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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18208791
Filing Dt:
06/12/2023
Publication #:
Pub Dt:
12/21/2023
Inventors:
Chih-Lung YU, Pin-Sheng WANG, Yan-Chiuan LIOU, Yu-Chuan LIU, Yu-Chi LIN, Teng-Kuei CHEN
Title:
FAN-OUT TYPE PACKAGING STRUCTURE
Assignment: 1
Reel/Frame:
063930/0728Recorded: 06/13/2023Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/01/2023
Exec Dt:
06/01/2023
Exec Dt:
06/01/2023
Exec Dt:
06/01/2023
Exec Dt:
06/01/2023
Exec Dt:
06/01/2023
Assignee:
4F., NO. 50-1, KEYAN RD., ZHUNAN TOWNSHIP
MIAOLI COUNTY, TAIWAN 350
Correspondent:
DLA PIPER LLP (US)
2000 UNIVERSITY AVENUE
EAST PALO ALTO, CA 94303-2248

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