Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17841451
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Filing Dt:
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06/15/2022
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Publication #:
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Pub Dt:
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12/21/2023
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Inventors:
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Omkar G. Karhade, Kaveh Hosseini, Chia-Pin Chiu, Tim T. Hoang, Tolga Acikalin et al
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Title:
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PHOTONICS PACKAGING WITH HIGH-DENSITY ROUTING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| ALLIANCE IP, LLC |
| 20 E. THOMAS ROAD SUITE 2200 |
| PHOENIX, AZ 85012 |
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