Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18361705
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Filing Dt:
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07/28/2023
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Publication #:
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Pub Dt:
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12/21/2023
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Inventors:
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Huan-Chieh SU, Li-Zhen YU, Chun-Yuan CHEN, Cheng-Chi CHUANG, Shang-Wen CHANG et al
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Title:
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INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE VIA RAIL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| R. BURNS ISRAELSEN |
| 1027 DUFFER LN. |
| NORTH SALT LAKE CITY, UT 84054 |
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