Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18343599
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Filing Dt:
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06/28/2023
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Publication #:
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Pub Dt:
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12/28/2023
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Inventor:
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Ji Hoon Hong
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Title:
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WAFER LEVEL CHIP SCALE PACKAGE WITH RHOMBUS SHAPE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| USPACE-1 A DONG, 8TH FLOOR 660, DAEWANGPANGYO-RO |
| BUNDANG-GU, GYEONGGI-DO |
| SEONGNAM-SI, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 13494 |
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| NO. 6 LIANHUI STREET, XIXING STREET |
| BINJIANG DISTRICT, ZHEJIANG PROVINCE |
| HANGZHOU CITY, CHINA 310051 |
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| OSHA BERGMAN WATANABE & BURTON LLP |
| 1100 LOUISIANA |
| SUITE 4900 |
| HOUSTON, TX 77002 |
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06/27/2024 12:43 AM
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