Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/27/2024
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Application #:
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18034812
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Filing Dt:
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05/01/2023
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Publication #:
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Pub Dt:
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12/28/2023
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Inventor:
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Ties VAN BOMMEL
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Title:
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LED FILAMENT ARRANGEMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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HIGH TECH CAMPUS 48 |
EINDHOVEN, NETHERLANDS 5656 AE |
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SIGNIFY NORTH AMERICA CORPORATION |
1 VAN DE GRAFF DRIVE |
SUITE 202 |
BURLINGTON, MA 01803 |
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09/26/2024 08:38 AM
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