Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18342724
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Filing Dt:
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06/27/2023
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Publication #:
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Pub Dt:
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12/28/2023
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Inventor:
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Changzhi SHI
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Title:
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DEVICES AND METHODS FOR TESTING OF THROUGH SILICON VIAS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AREA B, 8TH FLOOR, BUILDING 1, NO. 333 HUANGQING ROAD, JIADING DISTRICT |
| SHANGHAI, CHINA |
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| XIANG LONG |
| 8407 CENTRAL AVE, SUITE 2077 |
| NEWARK, CA 94560 |
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06/19/2024 02:47 PM
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