Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17851937
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Filing Dt:
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06/28/2022
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Publication #:
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Pub Dt:
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12/28/2023
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Inventors:
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Gamal REFAI-AHMED, Suresh RAMALINGAM
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Title:
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CHIP PACKAGE WITH PASS THROUGH HEAT SPREADER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2100 LOGIC DRIVE |
| SAN JOSE, CALIFORNIA 95124 |
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| XILINX, INC. |
| 2100 LOGIC DRIVE |
| SAN JOSE, CA 95124 |
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06/25/2024 03:28 AM
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