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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
17851957
Filing Dt:
06/28/2022
Publication #:
Pub Dt:
12/28/2023
Inventors:
Cemil S. Geyik, Kristof Kuwawi Darmawikarta, Zhiguo Qian, Kemal Aygun, Jung Kyu Han et al
Title:
INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-LAYER
Assignment: 1
Reel/Frame:
060341/0065Recorded: 06/28/2022Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/11/2022
Exec Dt:
06/09/2022
Exec Dt:
06/12/2022
Exec Dt:
06/09/2022
Exec Dt:
06/26/2022
Exec Dt:
06/09/2022
Exec Dt:
06/21/2022
Exec Dt:
06/15/2022
Assignee:
333 BRANNAN STREET
SAN FRANCISCO, CALIFORNIA 94107
Correspondent:
ALISHA FEUSTEL
AKONA IP PC
3244 CARAVAN DRIVE
PLANO, TX 75025
Assignment: 2
Reel/Frame:
062019/0594Recorded: 11/30/2022Pages: 12
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 060341 FRAME: 0065. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
Exec Dt:
06/11/2022
Exec Dt:
06/09/2022
Exec Dt:
06/12/2022
Exec Dt:
06/09/2022
Exec Dt:
06/26/2022
Exec Dt:
06/09/2022
Exec Dt:
06/21/2022
Exec Dt:
06/15/2022
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
LORI CALNAN
4757 W PARK BLVD, STE 113-1026
AKONA IP PC
PLANO, TX 75093

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