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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17848069
Filing Dt:
06/23/2022
Publication #:
Pub Dt:
12/28/2023
Inventors:
Benjamin T. Duong, Srinivas V. Pietambaram, Kristof Kuwawi Darmawikarta
Title:
MICROELECTRONIC ASSEMBLIES WITH ANCHOR LAYER AROUND A BRIDGE DIE
Assignment: 1
Reel/Frame:
060296/0065Recorded: 06/23/2022Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/08/2022
Exec Dt:
06/09/2022
Exec Dt:
06/03/2022
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
ALISHA FEUSTEL
AKONA IP PC
3244 CARAVAN DRIVE
PLANO, TX 75025

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