Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18130573
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Filing Dt:
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04/04/2023
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Publication #:
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Pub Dt:
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12/28/2023
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Inventors:
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Hongfeng JIN, Hongxu YANG, Hualun CHEN
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Title:
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Digital Isolator Structure and Method for Forming the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 30 XINZHOU ROAD, XINWU DISTRICT |
| WUXI, CHINA 214028 |
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| BOYLE FREDRICKSON S.C. |
| 840 NORTH PLANKINTON AVENUE |
| MILWAUKEE, WI 53203 |
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