Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18318267
|
Filing Dt:
|
05/16/2023
|
|
Publication #:
|
|
Pub Dt:
|
12/28/2023
| | | | |
|
Inventors:
|
Hsiang-Yu LEE, Shang CHIN, Ping-Tsun LIN
|
|
Title:
|
CIRCUIT STRUCTURE FOR HOT-PRESS BONDING
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 17F.-2, NO. 75, SEC. 1, XINTAI 5TH RD., XIZHI DIST. |
| NEW TAIPEI CITY, TAIWAN 221 |
|
|
|
|
| MUNCY, GEISSLER, OLDS & LOWE, PC |
| 125 S. ROYAL ST. |
| ALEXANDRIA, VA 22314 |
|
|
Search Results as of:
06/29/2024 02:28 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
