Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18255299
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Filing Dt:
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05/31/2023
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Publication #:
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Pub Dt:
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01/04/2024
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Inventors:
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Markus SCHEIBEL, Stefan MAUSNER, Sungsig KANG, Martin SATTLER, Anton-Zoran MIRIC et al
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Title:
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PROCESS FOR THE MANUFACTURE OF ENCAPSULATED SEMICONDUCTOR DIES AND/OR OF ENCAPSULATED SEMICONDUCTOR PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HERAEUSSTRASSE 12 - 14 |
| HANAU, GERMANY 63450 |
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| BLOCK 5014, ANG MO KIO AVENUE 5 |
| #07-01 TECHPLACE II |
| SINGAPORE, SINGAPORE 569881 |
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| COLSON LAW GROUP |
| 5555 MAIN STREET |
| BUFFALO, NY 14221 |
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06/25/2024 10:39 AM
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