Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18368355
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Filing Dt:
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09/14/2023
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Publication #:
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Pub Dt:
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01/04/2024
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Inventors:
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Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini et al
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Title:
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METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARRIER LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| HALEY GUILIANO LLP |
| 75 BROAD STREET |
| SUITE 1000 |
| NEW YORK, NY 10004 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3025 ORCHARD PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
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| HALEY GUILIANO LLP |
| 75 BROAD STREET |
| SUITE 1000 |
| NEW YORK, NY 10004 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 3025 ORCHARD PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
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| HALEY GUILIANO LLP |
| 75 BROAD STREET |
| SUITE 1000 |
| NEW YORK, NY 10004 |
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Assignment:
4
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 3025 ORCHARD PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
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| HALEY GUILIANO LLP |
| 75 BROAD STREET |
| SUITE 1000 |
| NEW YORK, NY 10004 |
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