Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17856689
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Filing Dt:
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07/01/2022
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Publication #:
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Pub Dt:
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01/04/2024
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Inventors:
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Hung-Yi Kuo, Chen-Hua Yu, Kuo-Chung Yee, Cheng-Chieh Hsieh, Chung-Ju Lee, Szu-Wei Lu
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Title:
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Package with Improved Heat Dissipation Efficiency and Method for Forming the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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SLATER MATSIL, LLP |
17950 PRESTON RD., SUITE 1000 |
DALLAS, TX 75252 |
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09/25/2024 01:52 PM
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