Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18361196
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Filing Dt:
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07/28/2023
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Publication #:
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Pub Dt:
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01/04/2024
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Inventors:
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Shin-Puu JENG, Shuo-Mao CHEN, Feng-Cheng HSU
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Title:
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CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| MCCLURE, QUALEY & RODACK LLP |
| 280 INTERSTATE NORTH CIRCLE |
| SUITE 530 |
| ATLANTA, GA 30339 |
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