Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17811624
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Filing Dt:
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07/11/2022
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Publication #:
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Pub Dt:
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01/11/2024
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Inventors:
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Bainian Qian, Donna M. Alden, Sheng-Huan Tseng
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Title:
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Chemical Mechanical Planarization Pad Having Polishing Layer with Multi-lobed Embedded Features
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 451 BELLEVUE ROAD |
| NEWARK, DELAWARE 19713 |
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| DUPONT SPECIALTY PRODUCTS USA, LLC |
| 974 CENTRE ROAD |
| WILMINGTON, DE 19805 |
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Search Results as of:
06/22/2024 01:00 AM
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