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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18217044
Filing Dt:
06/30/2023
Publication #:
Pub Dt:
01/11/2024
Inventors:
Edward Fürgut, Wolfgang Scholz, Christian Baeumler, Thomas Basler, Xing Liu et al
Title:
Semiconductor Package or a Printed Circuit Board, Both Modified to One or More of Reduce, Inverse or Utilize Magnetic Coupling Caused by the Load Current of a Semiconductor Transistor
Assignment: 1
Reel/Frame:
066163/0497Recorded: 01/18/2024Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/03/2023
Exec Dt:
07/03/2023
Exec Dt:
01/18/2024
Exec Dt:
07/24/2023
Exec Dt:
07/24/2023
Exec Dt:
07/24/2023
Assignee:
SIEMENSSTRASSE 2
VILLACH, AUSTRIA 9500
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
PO BOX 1959
CARY, NC 27512-1959

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