Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18214572
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Filing Dt:
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06/27/2023
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Publication #:
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Pub Dt:
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01/11/2024
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Inventors:
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Chun-Te Lee, Chih-Ming Peng, Pi-Yu Peng, Hui-Yu Huang, Yin-Chen Lin
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Title:
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FLIP CHIP PACKAGE AND SUBSTRATE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.3, LIHSIN 5 RD., HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN |
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| DEMIAN K. JACKSON |
| 106 STARVALE LANE |
| SHIPMAN, VA 22971 |
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09/24/2024 01:57 AM
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