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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	NONE	Issue Dt:		Application #:	18160019	Filing Dt:	01/26/2023
Publication #:	20240014282	Pub Dt:	01/11/2024
Inventors:	Kuan-Kan HU, Tsung-Kai CHIU, Wei-Yen WOON, Szuya LIAO, Ku-Feng YANG
Title:	METAL FEATURES OF A SEMICONDUCTOR DEVICE AND METHODS FOR FORMING THE SAME

Assignment: 1

Reel/Frame:

062582/0064

Recorded: 02/03/2023

Pages: 4

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

HU, KUAN-KAN

Exec Dt:

11/07/2022

CHIU, TSUNG-KAI

Exec Dt:

11/09/2022

WOON, WEI-HEN

Exec Dt:

11/07/2022

LIAO, SZUYA

Exec Dt:

11/10/2022

YANG, KU-FENG

Exec Dt:

11/07/2022

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

8, LI-HSIN RD. 6

HSINCHU SCIENCE PARK

HSINCHU, TAIWAN 300-78

Correspondent:

HAYNES AND BOONE, LLP IP SECTION

2323 VICTORY AVENUE

SUITE 700

DALLAS, TX 75219

Assignment: 2

Reel/Frame:

063544/0004

Recorded: 05/04/2023

Pages: 7

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE 3RD INVENTOR'S NAME PREVIOUSLY RECORDED ON REEL 062582 FRAME 0064. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.

Assignors:

HU, KUAN-KAN

Exec Dt:

11/07/2022