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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18481510
Filing Dt:
10/05/2023
Publication #:
Pub Dt:
01/25/2024
Inventors:
Sabyasachi Ganguli, Ajit K Roy, Chenggang Chen
Title:
Highly Conductive Strain Resilient Electronics Interconnects and Traces
Assignment: 1
Reel/Frame:
065181/0849Recorded: 10/11/2023Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/28/2018
Exec Dt:
08/27/2018
Exec Dt:
08/24/2018
Assignee:
2240 B STREET
AREA B, BUILDING 11
WRIGHT-PATTERSON AFB, OHIO 45433
Correspondent:
AFMCLO/JAZ
2240 B STREET
AREA B, BUILDING 11
WRIGHT-PATTERSON AFB, OH 45433

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