Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18223741
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Filing Dt:
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07/19/2023
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Publication #:
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Pub Dt:
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01/25/2024
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Inventor:
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WEI-LIN CHEN
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Title:
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IC PACKAGE WITH VERY THIN VAPOR CHAMBER FOR HEAT DISSIPATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 4, 19 F, NO. 1, BAOSHENG ROAD, YONGHE DIST., |
| NEW TAIPEI CITY, TAIWAN 234 |
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| ROOM 4, 19 F, NO. 1, BAOSHENG ROAD, YONGHE DIST., |
| NEW TAIPEI CITY, TAIWAN 234 |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 8230 BOONE BLVD, SUITE 405 |
| VIENNA, VA 22182 |
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