Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17814525
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Filing Dt:
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07/24/2022
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Publication #:
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Pub Dt:
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01/25/2024
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Inventors:
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Wei-Yu Chen, Hua-Wei Tseng, Li-Hsien Huang, Yinlung Lu, Jun He
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Title:
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WAFER-ON-WAFER PACKAGING WITH CONTINUOUS SEAL RING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| KILPATRICK TOWNSEND & STOCKTON LLP |
| 1100 PEACHTREE STREET, NE SUITE 2800 |
| ATLANTA, GA 30309 |
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05/29/2024 05:20 PM
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