Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18192745
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Filing Dt:
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03/30/2023
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Publication #:
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Pub Dt:
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02/01/2024
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Inventors:
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Chien-Yi Chen, Kao-Chih Liu, Chia Hong Lin, Yu-Ting Lin, Min-Feng Ku
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Title:
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Repackaging IC Chip For Fault Identification
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| HAYNES AND BOONE, LLP (24061) IP SECTION |
| 2323 VICTORY AVENUE |
| SUITE 700 |
| DALLAS, TX 75219 |
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05/28/2024 08:45 AM
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