Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17876813
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Filing Dt:
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07/29/2022
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Publication #:
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Pub Dt:
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02/01/2024
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Inventors:
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Yingshi Tang, Yingying Wang, Padam Jain, Emad Samadiani et al
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Title:
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Pin Fin Placement Assembly for Forming Temperature Control Element Utilized in Device Die Packages
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1600 AMPHITHEATRE PARKWAY |
| MOUNTAIN VIEW, CALIFORNIA 94043 |
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| LERNER, DAVID, LITTENBERG, KRUMHOLZ & MENTLIK, LLP |
| 20 COMMERCE DR. |
| CRANFORD, NJ 07016 |
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06/19/2024 05:19 PM
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